Best Sodium Hypophosphite CAS 7681-53-0

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Sodium Hypophosphite

Name: Sodium Hypophosphite

Cas: 7681-53-0

Purity: 99%min


Directory Guidance on Sodium Hypophosphite

Chemical Structure

Sodium Hypophosphite

Basic Info:

CAS No:7681-53-0
Stock AvailabilityIn stock
Brand NameLook chem

Product Introduction:

Sodium hypophosphite is an inorganic salt with the chemical formula NaH2PO2, monoclinic crystal or pearly crystal or white crystalline powder.

It is easily soluble in water, ethanol, glycerin, slightly soluble in ammonia, ammonia water, and insoluble in ether.

Sodium Hypophosphite is neutral in aqueous solution and has strong reducing properties.

Sodium Hypophosphite is relatively stable when stored in a dry state, and rapidly decomposes when heated above 200°C, releasing toxic phosphine that can ignite spontaneously.

It will explode when exposed to strong heat, and will explode when mixed with potassium chlorate or other oxidants.

Sodium hypophosphite is a strong reducing agent, which can reduce the salts of gold, silver, mercury, nickel, chromium, diamond, etc. to a metallic state.

Nature and Specifications:

Product Packaging


Product Usage:

Used as an electroless plating agent

  • Chemical Plating (Chemical Plating) is a technology to realize the metalization of non-conductor surfaces, which is widely used in surface modification, printed circuit manufacturing, electromagnetic shielding technology, electronic component packaging and other fields.
  • The use of other reducing agents in the electroless copper plating solution to replace formaldehyde has been reported in the literature and patents. The main alternative reducing agents are dimethylamine borane (DMAB), glyoxylic acid, and Sodium Hypophosphite.
  • Among them, the electroless plating system using Sodium Hypophosphite as the reducing agent has the characteristics of low pH, low cost and relative safety, and has great development value and application prospects.

Used as antiseptic and fresh-keeping agent

  • Sodium Hypophosphite can play a role in preservation and bacteriostasis, and it can preserve the freshness of fruits, vegetables and cut flowers.
  • It has antiseptic preservation effect on meat, poultry and fish.
  • Its products can also be used as food additives.

Industrial applications

  • Sodium Hypophosphite can be used to prepare various industrial preservatives and oilfield scale inhibitors, etc. It is also used to make food industry boiler water additives, recover various metals from various electroless plating wastewater and remove chlorides and cyanates.
  • Catalyst, stabilizer, preparation of polyamide polymer polyamide, speed up chemical reaction.
  • It can also be used as a stabilizer for chemical reactions, bleaching of mechanical pulp, and a stabilizer for peroxides.
  • Sodium Hypophosphite is also used as an antioxidant, anti-bleaching agent, dispersant, textile finishing and medicine industries.

How Sodium Hypophosphite works:

For sodium hypophosphite reduction electroless copper plating and other electroless copper plating processes, they have the same chemical principle.

Its essence is also an electroless copper plating method to reduce the free copper ions in the copper plating solution to solid copper crystals and plate them on the surface of the substrate with the help of a suitable reducing agent.

Nowadays, the electroless copper plating process for sodium hypophosphite reduction is very similar to the electroless copper plating process for formaldehyde reduction, but the reaction mechanism is much more complicated.

This is because pure metallic copper has no catalytic activity for the oxidation reaction of sodium hypophosphite.

When using it as a reducing agent for electroless copper plating, it cannot achieve an autocatalytic electroless plating reaction through the copper particles and silver particles produced in the activation and sensitization stages like the formaldehyde system.

To make the electroless copper plating reaction of the sodium hypophosphite system continue, it is necessary to add a substance with catalytic activity for the electroless plating reaction.

The current way to solve this technical problem is to learn from the process principle of electroless nickel plating.

Nickel ions are added to the plating solution, and a copper plating layer containing a small amount of nickel is obtained through the co-deposition of metallic nickel and copper.

The deposited nickel particles can catalyze the reaction of sodium hypophosphite reducing Cu2+, so as to ensure the continuous progress of the electroless copper plating reaction, and finally obtain a high-quality copper coating.

Related References:

  1. Federal Register, Vol. 66, No. 201 – Wednesday, 17 October 2001.
  2. Substances covered – Section 1310.02 – Code of Federal Regulations.
  3. Wikipedia

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