The electronics manufacturer in Shenzhen had been using expanded ♦polystyrene foam inserts to protect circuit boards during shipping for three years without a single damage claim worth noting. Then they switched to a lower-cost domestic supplier for the molded foam trays, and within six weeks the returns started arriving. The boards themselves showed no impact damage, but they were arriving with a faint oily residue on connectors and gold contacts that was causing intermittent failures at final test in the customer’s facility. The foam had the same appearance, the same density to within tolerance, and the same nominal dimensions. What it did not have was the same residual styrene monomer specification and the same additive package. The new supplier’s material was releasing volatile residuals at a level that the original source did not. It took eleven weeks, four rounds of laboratory analysis, and a partial production shutdown to identify the source.